M.2 2280 PCIe PT33
M.2 2280 PCIe PT33 is a PCI-Express flash module with 3D TLC. Taking advantage of high-speed PCI-Express 3.0 x4 32Gb/s interface and up to 10K endurance, M.2 2280 PCIe PT33 greatly enhances computing performance and responsiveness on application launch speed and file loading time for server and time-critical AI and IoT applications. In a small M.2 2280 form factor, M.2 PCIe is ideal to operate with space constraints for host computing systems.
FEATURES
- PCIe Gen3x4 M.2 2280 with NVMe 1.3 supported
- Read/Write speeds of up to 2116/1340MB/s
- Random Performance of up to 188K/211K IOPS
- Industrial Micron 3D TLC, up to 10K P/E Cycles
- LDPC ECC for improved data integrity
- End-to-end data path protection with CRC parity, better safe and data guard features
- Featuring HMB (Host Memory Buffer), SLC caching and dynamic write acceleration
- Built-in OCP/OVP Protection
- 30u” thickness Gold finger
Interface | PCIe Gen 3 X4 |
Form Factor | M.2 PCIe (2280) |
Controller | SMI SM2263EN |
Flash Type | 3D TLC (Original Micron B17, 10K P/E cycle) |
Max. Channel | 4 |
Density | 128GB~2TB |
Sequential R/W (MB/sec, max.) | 2116/1340 |
Operating Temperature | 0°C~+70°C/-25°C~+85°C/-40°C~+85°C |
Max. Power Consumption | 4.9W (3.3Vx1500mA) |
Dimension (LxWxH/mm) | 80x22x3.5 |
Operating Voltage | 3.3V±5% |
Storage Temperature | -55°C~+95°C |
Security | ✓(AES 128/256 Encryption) ✓TCG Opal 2.0 compliant ✓Built-in H/W SHA256 and TRNG |
External DRAM Buffer | ✓ |
Thermal Sensor | ✓ |
NVMe 1.3 | ✓ |
Vibration | 20G (7~2KHz) |
Shock Resistance | 1500G@0.5ms |
MTBF | >3 million hours |
File Type | Documentation | Size | Format |
---|---|---|---|
Datasheet | MEMXPRO_DataSheet_M 2_2280_PCIe_PT33_V1.5.pdf | 443KB |